Plasma Technology


Sputter Etching:
Angle Dependences

Most materials show a maximum at 20 - 40°.
Just Au has its maximum at normal incidence (0°).
Reactive processes also often have their maximum at normal incidence, example Si RIBE.

ion beam system (etch or depostion)

Ionfab 300 Plus

* see   or sputter rates


angle dependence of sputter etch rates/6 kB

Rates in A/ min, angle: 0° (normal incidence) - 90°

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