Sputtering

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Sputtering technology

top electrode with water cooled

target top electrode driven by AC or DC

substrate electrode water cooled, grounded (RB bias optional)

System control: PLC (programmable logic controller) and PC 2000

Turbo or Cryo pump with dual stage rotary as backing pump

gate valve and APC (automatic pressure) control valve

pressure reading: CM gauge for process (Capacitance Manometer)

additional Penning for base pressure

MFC controlled gas lines (Mass Flow Controller)

layout of a (magnetron) sputtering system