Loadlock with He Cooling
Plasmalab 80 Plus (no loadlock)
Plasmalab System 100/133: Wafer/ Substrate transfer and "Helium Backside Cooling"
The substrate electrode is cooled by water
(or other media).
Helium is introduced between the cooled electrode and the substrate to establish an excellent thermal contact.
The clamping can be done mechanically (as shown)
by a ring (typically made of quarz) or electrostatically.
see: "electrostatic chuck"