Courtesy of Infineon Munich:
etched to M3

Reactive Ion Etching

Plasmalab 80 Plus
with laser interferometer

Equipment:
Plasmalab 80 Plus
  for chips and up to 200 mm wafer
Plasmalab 800 Plus
  for chips and up to 300 mm wafer
Plasmalab System 100/ 133

Results:
rate : ca 40 nm/min (chip)
residue free etch

Good uniformities over 
200/ 300 mm wafers can be achieved.

Courtesy of Infineon Munich:
etched to M1

Courtesy of Infineon Munich:
etched to M2