chemically assisted
ion beam etching CAIBE |
The SEM's (OPT application lab) show
ca. 5 µm deep etch under different
angles (without substrate rotation).
Photoresist Mask intact (not removed)
System: Ionfab 300 Plus
Results:
Rate: 10 - 500 nm/ min
Mask: Photoresist (over SiO2)
Wall Angle: adjustable
Surface: very smooth |
 |
