Uni Duisburg uses the Plasmalab RIE 80  System for Chlorine based RIE process. The etcher is equipped with a Nitrogen glove box to prevent water vapour entering the process chamber.

The photo shows the Plasmalab 80 Plus, which has replaced the Plasmalab 80.

with kind permission of:
  University of Duisburg
  Inst. fuer Halbleiterphysik
  Hr Josef, Dr Prost, Prof Tegude

RIE technology

Plasmalab 80 Plus
with Nitrogen Glove Box

250 µm deep via hole
no crystallographic effect
rate 1 µm/ min
Selectivity to PR 30 : 1

10 µm deep anisotropic etch
aspect ratio 10 : 1
rate 300 nm/ min
Selectivity to AlGaAs 1.000 : 1