TU Eindoven uses its Plasmalab System 100 RIE  System for Chlorine based III/ V etch processes.

COBRA Inter-University Research Institute
  on Communication Technology
  Eindhoven University of Technology
  Department of Electrical Engineering
  Contact: Dr F Karouta

RIE technology

Plasmalab System 100

1 µm deep, anisotropic GaN etch

1 µm deep, anisotropic GaN RIE

rate: 50 - 150 nm/ min

selectivity to PECVD SiN > 5 : 1

process gases: SiCl₄, SF₆, Ar