Plasmalab 80 Plus |
Technology:
Parallel Plate Reactor
Shower Head Gas Inlet
13.56 MHz Plasma Excitation
Process:
a) CH4 / H2 based at room temperature
b) CH4 / H2 / Cl2 based at ca. 200 °C
Results:
Rate :
a) 50 - 100 nm/min
b) 100 - 200 nm /min
Mask: Photoresist or SiO2
Profile: anisotropic, no undercut
Bottom: smooth
Wall: very slight roughness
Uniformity: + 5% |
OPT application lab:
1µm deep, anisotropic etch
aspect ratio 7 : 1 |
