OPT application lab, Yatton:
100 µm deep via hole
etched in InP

RIE technology

Plasmalab 80 Plus

Technology:
RIE-Mode: 13.56 MHz
Shower Head Gas Inlet
BCl₃ and HBr based process

Results:
rate > 2.5 µm/ min
uniformity < +/- 5 % (3” wafer)
selectivity > 15:1 to PR
profile: anisotropic (or shaped)

Plasmalab System 133