Plasmalab System 100
with vacuum loadlock

0.7 µm deep etch into PbSe
Photoresist stripped
OPT application lab, Yatton (UK)

Plasmalab 80 Plus

RIE technology

Technology:
Parallel Plate Configuration
Reactive IonEtching (RIE)
13 MHz Plasma Excitation

Results:
Rate : 50 - 100 nm/ min
Mask: Photoresist
Uniformity: +/ - 5% (75 mm)
Selectivity: 2 - 5:1
Profile: anisotropic, slightly rough