Anisotropic Photoresist RIE: 0.3 µm lines

Mr Widmer uses his Plasmalab 80 Plus RIE
system for Fluorine and O2 RIE processes.
The etcher is equipped with a Laser
Interferometer for end point detection.

with kind permission of:
Paul Scherrer Institute Zuerich
Mr Widmer

0.3 µm line side view

0.3 µm wide lines
etched in photoresist

The SEM's show 0.3 µm wide lines
(Cr not removed)

rate: 50 nm/ min with O₂RIE

laser interferometry for end
point detection

Uniformity < ± 3 %