signal from optical emission:
endpoint detection integrated in
PC2000 software
OE requires sufficient open area
to get a sufficient signal. |
|
Equipment:
Plasmalab 80 Plus
Plasmalab 800 Plus
Plasmalab System 133
Plasmalab System 100
Results: (Fluorine process)
Rate : ca. 25 - 100 nm/min*
Mask: Photoresist
Selectivity to PR mask: 3 - 10:1
Selectivity to Si: 8 - 20:1
Profil: controllable (30° - 90°)
Uniformity: +/- 3 %
*High rates require Helium cooling, if a PR mask is used.
Even higher rates are possible with hard masks. |
OPT application lab:
1 µm deep etch, PR mask in place
OPT application lab:
1.5 µm deep, anisotropic etch |
