Plasmalab System 100
with vacuum loadlock

0.85 µm deep, anisotropic etch
Photoresist mask intact
OPT application lab, Yatton (UK)

Plasmalab 80 Plus

RIE technology

Technology:
Reactive Ion Etching
13 MHz Plasma Excitation
Parallel Plate Reactor

Results:
Rate : ca. 20 nm / min
Profil: anisotropic
Surface: low roughness
Uniformity: +/- 5 % (75 mm)
Mask: Photoresist