|  Plasmalab 800 Plus main page
The Plasmalab 800 Plus can be
configured for
failure analysis applications for up to 300 mm wafers.
Our process engineer inspects a 300 mm wafer
after the isotropic SiN removal in PE mode
and an anisotropic SiO2 RIE etch step.
related pages:
failure analysis
etch processes
laser
interferometry for failure analysis |
