max. four 200 mm diameter targets
or six 75 mm or 100 mm, five 125 mm

DC, pulsed DC and RF magentron

water cooled substrate holder

deposition in rotating or static mode

heated process chamber

easy access for cleaning from the top

PC 2000 control with software under Windows™

vacuum loadlock

Substrate Bias and PreEtch

8 x  3"-6" or  4 x 8" wafers/ batch

rotating shutter

uniformity shields

Options

substrate heating

separate PreEtch module

Vacuum Cassette optional

cathodes from 75 mm to 200 mm diameter

PC 2000 control