Typical Applications:

Ion Beam Sputtering (IBS):

• deposition of metals as Au, Pt
• reactive deposition of ceramics as Al₂O₃
• reactive deposition of multilayer films: TiO₂, SiO₂

Dual Ion Beam Sputtering (DIBS):

• 2^nd source at OPT only used for precleaning

Direct Ion Beam Deposition (DIBD):

• DLC deposition directly from the source

IBS system layout

• rotating and tiltable substrate holder
• Deposition Ion Source: 3 - 7.5 cm 13.56 MHz driven
• filamentfree PBN beam neutralisation
• gas inlet through source and into the chamber
• high conductance pipework
• parameter: gas flows, ion energy, ion current, accelerator voltage, beam neutralisation
• revolving target plate/ cube with automatic shield
• second source for precleaning optional