Typical Applications:

• low damage photoresist stripping
• low damage isotropic SiN etching
• surface cleaning

"Microwave Downstream" with 2.45 GHz plasma

MWDS: manual tuning (three stubs)

"remote plasma"
no direct contact between the plasma and the substrate

see also: comparison ICP - ECR

MWDS has been replaced by ICP - RIE !

• lower (substrate) electrode grounded, RF driving opt.
• substrate electrode heated
• automatic height adjustment of the electrode opt.
• parameter: gas flows, pressure, source power, temperature
• plasma burns in the source only