Typical Application:  Failure Analysis

• isotropic PE fotoimide etching
• anisotropic RIE polyimide etching
• isotropic PE SiN removal
• anisotropic SiO₂ RIE etching

RIE/ PE layout

Laser Interferometry (for chips)

Optical Emission

RIE/ PE Layout

failure analysis processes

• substrate electrode cooled
• top or bottom electrode RF driven (13.56 MHz)
• automatic switching
• shower head gas inlet (in the top electrode)
• parameter: gas flows, pressure, RF power