• typical process pressure: 5 - 30 mtorr
• good step coverage
• standard method for high quality Al (with Si/Cu/Ti), TiN, TiW

Note:

The 400 sputtering module is part of the Plasmalab System 100 series and can be clustered with other modules, for example for plasma cleaning in a separate vacuum chamber.

Sputtering system layout

Typical Applications:

• high quality Al with Si/Cu/Ti
• diffusion barriers TiN, TiW (reactive sputtering)
• resistor films NiCr, TaN
• noble metals: Au, Pt...

• up to 4 x 200 mm or 8 x 75 mm cathodes
• substrates on a rotating holder
• substrate holder water cooled /heated (up to 400° C)
• PreEtch and RF Bias
• parameter: gas flows, pressure, RF power